The basic process of curing following response: lead oxidation loss of water ( plate drying ); paste of tribasic lead sulfate crystallization, grid surface corrosion.

①free lead oxide and grid surface corrosion in plate free lead oxide and grid surface corrosion essentially the two processes of the same, but they are not like the rate. Because the alloy added with crystalloblastic agent will affect the grid oxidation rate.

Plate curing paste in the water, free metal lead and curing time relationship.

When cured because the two processes of change rate are related to each other, water as a catalyst, in lead metal oxide is an exothermic reaction. Because the reaction produces heat, but also can be the plates moisture from evaporating out paste. Therefore higher water content and free lead oxidation rate is closely related to. When the lead paste water content of 7% in -8.5%, when the metal lead oxidation rate maximum.

When cured paste to keep the water content is about 8% only a very short time, oxidation processes of lead may be extended or its rate will reach the maximum value. If the lead paste the initial water content in 9.5%-10.5%, when the process is started, lead oxidation rate first increases, and then slowly changes, this is because the water content in the reduction of lead paste. When the water content of up to 8.5% of the value, the oxidation rate reaches a maximum value of the feature, if the lead paste the initial moisture content is higher than 10.5%, need a large number of thermal evaporation, prompted paste moisture to the fastest speed reduced to 8.5%. In the conditions of curing a slower start oxidation, heat release is not much also, and then only part of the metal oxide of lead. When the plates into the prior to curing water content is too low ( less than 6% ), the curing process can not be. Because the free lead is oxidized, recrystallization process has been completed. The temperature and humidity control of plate curing chamber can be solved in water is reasonable adjust, curing the indoor humidity control and operation, to ensure the plates oxidation to obtain maximum speed, thus curing the indoor temperature and humidity control is very important. Curing before the start of the 24h, lead oxide and water evaporation are at a high rate in, after 24h, water and metal lead content remained basically unchanged.

The curing process of plate free lead oxidation rate depends on the paste paste in moisture content and curing of indoor air temperature and humidity as well as the curing chamber air flow. Paste free lead oxide and lead powder particle size, lead is by nature a few micron particle surface oxidation of lead oxide and lead metal core is small particles. In and cream, part of lead oxide is reacted with sulfuric acid to produce a tribasic lead sulfate and lead oxide, metal parts for lead oxide. It also has retained 15% a ring of 20 metallic lead, through curing, these metal lead into lead oxide.